Polyimide film and Copper Clad Laminate Polyimide Film is an important material in the electronic plate manufacturing industry. The PI film have excellent Electrical Insulation and heat resistance.It can be used as a flexible substrate, which can make the circuit board more flexible and reliable.It is usual used for FPCB FCCL. Polyimide films can withstand high temperatures and do not react easily with other materials, making them more suitable for making reliable electronic components.
2024/01/22
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