double sided copper clad laminate polyimide film

October 07, 2023

double sided copper clad laminate Polyimide Film

double sided copper clad laminate polyimide film is advanced applications in military, aerospace, automotive and consumer electronics markets,

where reliable embedded resistor technology, temperature tolerance, and robust processing is required.

copper coated PI Film features:

Excellent resistive layer tolerance and electrical performance
Excellent dielectric thickness tolerance
Embedded capacitance and resistance in a single laminate
Thin, rugged copper clad laminate with superior handling and processing
High copper polyimide film adhesion strength
Low coefficient of thermal expansion for flex and rigid multi-layer PCBs

Excellent thermal resistance, up to 180C (356F) M.O.T.

Item		Unit	Thickness
Item		Unit	20	25	50
Hemispherical emissivity factor	metalized side	Ɛ	0.04±0.02
Hemispherical emissivity factor	non metalized side		0.61±0.02		0.69±0.02
Solar direct absorptance	metalized side	ρ＜1	0.09±0.02
Solar direct absorptance	non metalized side		0.33±0.02		0.38±0.02
Normal emittance		mm.mrad.	0.035
	high temp resistance	℃	400
thermal properties	low temp resistance	℃	200
	short term temp	℃	＜400
Adhesion of aluminum layer		N		1.45
ionization radiation effect		rad		3.10*9
salt-fog resistance	24h/5%Salinity ﹣195-200℃	100times≤	5% salt spray in 24 hours, test between -195 ℃ to 200℃, thermal cycle 100 times Meet 10 pcs humidity cycle tests at the same time

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